Center frequency MHz

(with tape on 95*95 mm ground plane)

915±2

-10dB Bandwidth MHz

≥12

V.S.W.R.@ Center Frequency

≤1.5

Axial ratio

≤5.0

Gain(Zenith) (dBic)

5.5 Typical

Polarization Model

R.H.C.P.

Impedance(Ohm)

50

Frequency Temperature Coefficient

≤20ppm/deg.℃

5.1

Humidity Test

The device is subjected to 90%~95% relative humidity 60℃±3℃ for 96h~98h,then dry out at 25℃±5℃ and less than 65% relative humidity for 2h~4h. After dry out the device shall satisfy

the specification in table 1.

It shall fulfill the specifications

in Table 1.

5.2

High Temperature Exposure

The device shall satisfy the specification in table 1 after leaving at 105℃ for 96h~98h,provided it would be measured after 2h~4h leaving in

25℃±5 ℃ and less than 65% relative humidity.

It shall fulfill the specifications

in Table 1.

5.3

Low Temperature

The device shall satisfy the specification in table 1 after leaving at -40℃ for 96h~98h,provided it would be measured after 2h~4h leaving in

25℃±5 ℃ and less than 65% relative humidity.

It shall fulfill the specifications

in Table 1.

5.4

Temperature Cycle

Subject the device to -40℃ for 30 min. followed by a high temperature of 105℃ for 30 min cycling shall be repeated 5 times. At the

room temperature for 1h prior to the measurement.

It shall fulfill the specifications

in Table 1.

5.5

Vibration

Subject the device  to vibration   for 2h each in  x、y and z axis with the amplitude of 1.5mm, the frequency shall be varied uniformly between the

limits of 10Hz~55Hz.

It shall fulfill the specifications

in Table 1.

5.6

Soldering Test

Lead terminals are heated up to 350℃±10℃ for 5s±0.5 s with brand iron and then element shall be measured after being placed in natural conditions for 1 h. No visible damage and it

shall fulfill the specifications in Table 1

It shall fulfill the specifications

in Table 1.

5.7

Solder ability

Lead terminals are immersed in soldering bath of 260℃~290℃ for 3s±0.5s . More than 95% of the terminal surface of the device shall be

covered with fresh solder.

The terminals shall be at least 95% covered by

solder.

5.8

Terminal Pressure Strength

Force of 2kg is applied to each lead in axial direction for 10s±1 s (see drawing). No visible damage and it shall fulfill the specifications in

Fig 1

Mechanical damage such as breaks shall not

occur.

Center Frequencychange

±2.0

-10dB Bandwidth Change

±3.0