2019-07-06
Good news: independent research and development, international leading, CSP package mass production
Good news! StrongFirst independently researches and develops the surface acoustic wave filter and duplexer with the international leading level CSP (Chip Size Package) packaging technology, and has passed the certification of relevant departments and obtained the certificate of high-tech product certification.
The CSP surface acoustic wave filter adopts the chip flip-chip process, and the device shape is close to the chip size. It has the characteristics of small size, high frequency, high power tolerance, high reliability and low cost. It is mainly used for RF circuits of 5G mobile phones and mobile communication applications.
StrongFirst R&D report
