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    For customers designing Atmel Corporation

    We are pleased to introduce you to our crystal unit

      Items to Confirm (designing of oscillation circuit)

    · Selection Guidance for crystal unit

    · Crystal Products Lineup

    · Oscillation Circuit and Selection Guidance of Crystal Unit.

    · Precautions for designing of PCB Board

    Crystal Recommendations for Atmel Corporation "AVR RF chips".

    · Recommendations AVR RF chips.

    > Clock solution recommendations for Atmel Corporation AVR RF chips


    In realizing low power consumption RF designs, the following factors should be taken into consideration.

    1. Oscillation start-up time

    2. Frequency tuning

    3. Lower BER(Bit Error Rate) over operating temperature

    No.

    Oscillation Circuit Factor

    2.4 GHz

    < AT crystal unit spec.>

    1

    Quick oscillation start-up time
    *High oscillation allowance
    *Boost inverter

    *Lower ESR(R1)
    *High drive level

    2

    Easy frequency control
    *inner frequency tuning capacitor

    *proper frequency sensitivity
    *low parameters' variation

    3

    Lower BER
    *temperature compensation

    *High frequency stability



    MHz Crystal equivalent circuit

    Rapid Oscillation start-up time
    → Lower ESR (R1) , Higher C1
    → Higher drive level

    Suitable Frequency Tuning
    → Lower parameters variation(C0,C1,L1,ESR)

    Suitable Frequency Tuning
    → Proper Sensitivity (CL,C0)

    Higher Frequency Stability
    → Stable fSTA

    QMEMS Technology

    Clock solution recommendations for Atmel Corporation AVR RF chips

    Worldwide

    ATmega256RFR2
    ATmega128RFA1

    AT86RF233
    AT86RF231

    AT86RF212B
    AT86RF212

    US

    Europe

    Japan

    Asia

    ZigBee
    IEEE802.15.4

    2400 to 2483.5 MHz

    700/800/900 MHz

    Recommendable
    Clock Devices

    S2520-16.000M-9-20-20-A
    16MHz,9pF

    Notes: Above recommendations are based on actual evaluation results and intended to support users in picking the right components. As the actual board layout and choice of external components influences the best suitable crystal load capacitance, We does not assume any responsibility and grant warranty for above recommendations. Users design must be verified and decided by own and individual evaluation.
    Please refer to Atmel Corporation AVR RF chips manual for designing.

    *ZigBee is a registered trademark of Koninklijke Philips Electronics N.V.

    Items to Confirm (designing of oscillation circuit)

    Please note: to design oscillation circuit, you need to confirm the electronic characteristics as follows:

    Oscillation allowance and Negative resistance (-R):
    You need to confirm oscillation capability.
    We recommend the condition: (-R) / ESR > 5
    * -R: Negative resistance, ESR: Equivalent Series Resistance
    Drive Level:
    You need to confirm if oscillation is stable, and if the drive level is within the specification.
    Load Capacitance:
    Load capacitance affects frequency stability, oscillation allowance, negative resistance, and start-up time of oscillation.
    In addition the load capacitance is determinative factor of crystal unit's load capacitance (CL value) directly.
    * frequency stability: frequency deviation out of circuit conditions.

    Selection Guidance for crystal unit

    When Customer selects crystal unit, lload capacitance (CL value) is an important factor of the selection.
    For instance, crystal with small CL(7.0 pF) makes larger oscillation allowance, smaller current consumption and worse frequency stability, like below table.
    Oppositely, crystal with large CL(12.5 pF) makes smaller oscillation allowance, larger current consumption and better frequency stability.
    Please select it in consideration of these characteristics.

    StrongFirst Crystal Product Lineup

    Product

    Size [mm]

    Applications

    Images

    S2520

    2.5×2.0×0.55t

    -Mobile phone,Bluetooth,W-LAN
    -ISM band,Clock for MPU

    Oscillation Circuit and Selection Guidance of Crystal Unit for AVR RF chips

    Pin number of XTAL1/XTAL2

    XTAL1

    XTAL2

    ATmega256RFR2

    57

    56

    ATmega128RFA1

    57

    56

    AT86RF23x, 212/212B

    26

    25

    Internal trimming capacitors of AVR RF chips (Default)

    Ctrim (XTAL_TRIM)

    0

    pF


    IC
    name

    product
    name

    Freq.[Hz]

    CL*1
    [pF]

    f_tol*2
    [ppm]

    Product
    Code*3

    External parts *4

    Package
    size[mm]
    WxDxH

    Cg
    [pF]

    Cd
    [pF]

    ATmega256RFR2

    S2520

    16M

    9.0

    10

    S2520-16.000M-9-10-10-A

    12

    12

    2.5x2.0x0.55

    ATmega128RFA1

    AT86RF233

    20

    S2520-16.000M-9-20-20-A

    12

    12

    AT86RF231

    AT86RF212B

    AT86RF212

    Notes:*

    1. Load capacitance.

    2. Frequency tolerance (standard)

    3. Two digits of the product code is packing specification, please refer here for the detail.

    4. Above recommendations are based on actual evaluation results and intended to support users in picking the right components. And the results are only according to the sample set that received from our customers, so it is not including the dispersion trend of IC and the external parts.
    As the actual board layout and choice of external components influences the best suitable crystal load capacitance, We do not assume any responsibility and grant warranty for above recommendations. Users design must be verified and decided by own and individual evaluation.


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